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|  | | Reflow Soldering Processes: SMT, BGA, CSP and Flip Chip Technologies
by Ning-Cheng Lee
Hardcover, 280 Pages, Published 2002 by Newnes
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|  | | Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials: With Lead-free, Halogen Free, and Conductive Adhesive Materials (Professional Engineering)
by John H. Lau, C.P. Wong, Ning-Cheng Lee, Ricky S.W. Lee
Hardcover, 700 Pages, Published 2002 by McGraw-Hill Professional
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|  | | Biography of Tsung Dao Lee: the First Chinese American to Win the Nobel Prize in Physics ('Gui fan yu dui cheng zhi mei-yang zhen ning zhuan', in traditional Chinese, NOT in English)
by Chaijian Jiang
Paperback, Published 2002 by Tian Xia
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|  | | Lectures on frontiers in physics
by Chen Ning Yang
Unknown Binding, 151 Pages, Published 1980 by Korean Physical Society/Korea Science and Engineering Foundation
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