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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
by Gerard Kelly
Hardcover, 134 Pages, Published 1999, 1st Edition


List Price: $189.00

ISBN-10: 0-7923-8485-7        (0792384857)

ISBN-13: 978-0-7923-8485-4 (9780792384854)
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