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![]() | Introduction to Materials Science for Engineers (5th Edition) by James F. Shackelford ISBN-10: 9780130112873 ISBN-10: 0-13-011287-9 ISBN-13: 9780130112873 ISBN-13: 978-0-13-011287-3 Hardcover 1999-12-30 Prentice Hall Find Lowest Price | |
Editorials | ||
Product Description This book provides balanced, current treatment of the full spectrum of engineering materials, covering all the physical properties, applications and relevant properties associated with engineering materials. The book explores all of major categories of materials while offering detailed examinations of a wide range of new materials with high-tech applications. The reader is treated to state-of-the-art computer generated crystal structure illustrations, offering the most technically precise and visually realistic illustrations available. The book includes over 350 exercises with sample problems to provide guidance. Materials for Engineering, Atomic Bonding, Crystal Structure and Defects, Diffusion, Mechanical Behavior, Thermal Behavior, Failure Analysis & Prevention. Phase Diagrams, Heat Treatment, Metals, Ceramics and Glasses, Polymers, Composites, Electrical Behavior, Optical Behavior, Semiconductor Materials, Magnetic Materials, Environmental Degradation, Materials Science. For mechanical and civil engineers and machine designers. | ||
Reviews | ||
Are there better books than this? This book is okay. It has a lot of important information in it, and good examples, but they are pretty well hidden among the unnecessary gibber. It's a good book, however I didn't really use it much, other than doing problems and the example problems. | ||
Tries hard, but missing some essentials This book tries hard to be clear, providing summaries, a glossary, and boldfacing terminology. I surmise that this book is written for people with little to no background in chemistry, physics, or mechanics of materials, because few things are derived from first principles. For instance, the crystal structures (rock salt, zinc blende, cesium chloride, etc.) presented in Chapter 3 are...well...just "presented," without any plausible explanation for their occurrance. It was as if their sole presence was to memorize them, without basing them in any sort of first principles. Quickly do I grow bored from books such as these, and, worse yet, no concepts really sink in. It was not until I read the excellent Materials text written by Callister that I understood at least one theory as to why these specific structures occur (ionic charge and ionic radii), and the concepts sank in. Sorry, Dr. Shackleford, but until I see things derived from first principles, they do not sink in for me. Perhaps, however, a person working in industry would better benefit from such a text. Since this book is titled, specifically, as "...for scientists and engineers," I unabashedly assign two stars to this book. If a later edition came out with better explanations and theories (as described above) I would be happy to read it and rescind this review. | ||
Chapter 3 Chapter 3, being the 2nd longest chapter, is full of plenty of valuable information. It is by no means a recreational reading material due to the wordy nature of the text. However, studied closely there is a bountiful amount of information on metal, ceramics and plastics at the atomic level. The author does a good job explaining the introductory material and could possible write another book entirely on this subject. Due to the wordy, technical nature, I will refrain from giving "two thumbs up" and only give 4 stars. | ||
Chapter 15 Chapter 15 of "Materials Science for Engineers" describes the physical properties of electrical behavior. This chapter does a good job of explaining the properties of conduction and resistance. It also explains why metals are good conductors and what actually happens in a semiconductor material. This textbook is good as a prerequisite text before starting the core studies in electrical engineering. It provides a good background to the phenomena of electrical behavior at the atomic level. This chapter, as well as the other chapters involving electricity, deal with material properties and not the physics of electricity. This chapter hints at the property of superconductivity. I still don't fully comprehend this topic after reading chapter 15, but there are numerous publications written about this concept alone. | ||
A decent book, Ch6 for example Chapter 6 covers the topic of Mechanical Behavior in 6 sub-sections. These sections include the stress versus strain relationship (a.k.a. Young's Modulus), elastic and plastic deformation, hardness, creep and stress relaxation, and viscoelastic deformation. Section one discusses Young's Modulus in relation to metals, ceramics and glasses, and polymers. In this sub-section, engineering stress/strain and the differences between elastic/plastic deformations are discussed, as well as yield strength and tensile strength. This section includes some nice reference tables, and describes the stress/strain curve in great detail. Sections two and three discuss elastic and plastic deformations. In the latter section, the slip plane for crystalline solids is well covered with some interesting illustrations. Section four discusses hardness tests, in particular, Rockwell hardness and Brinell hardness numbers. Creep and stress relaxation are discussed in section five, and covers the dislocation climb in plastic deformation among other topics. I feel that a better explanation regarding the preexponential constant is needed in this section. The last section deals with viscoelastic deformation, and discusses various topics such as the glass transition temperature, viscous deformation, and softening temperatures. Also of interest is the subject of tempered glass, which is discussed in some detail. This chapter does well in describing the general terminology and includes several equations with a practical application through example problems. In my opinion, though, this chapter doesn't cover enough information to answer some of the end of chapter problems, but a little on-line research should yield the required information. | ||